Solvent-Based Postforming Applications
Our solvent-based adhesives offer high performance in postforming processes where materials like laminate are applied to substrates such as MDF or particleboard, especially on inclined or curved edges. Since these applications require the material to be shaped by heating, it is critically important for the adhesive to have high thermal resistance. Our solvent-based solutions withstand the heat and tension of the postforming line, ensuring a strong and permanent bond even on the curved edges of the laminate.
| PRODUCT CODE | APPLICATION | INGREDIENT | ACTION |
|---|---|---|---|
| UNIVEX 234 | Postforming | Neoprene | Contact Us |
| UNIVEX 235 ISI | Postforming | Neoprene | Contact Us |
| UNIVEX 235 | Postforming | Neoprene | Contact Us |